Job Description

Company:

Qualcomm India Private Limited

Job Area:

Engineering Group, Engineering Group > Mechanical Engineering

General Summary:

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Mechanical Engineer, you will design, analyze, troubleshoot, and test electro-mechanical systems and packaging. Qualcomm Engineers collaborate across functions to provide design information and complete project deliverables.

Minimum Qualifications:

• Bachelor's degree in Mechanical Engineering or related field and 2+ years of Mechanical Engineering or related work experience.
OR
Master's degree in Mechanical Engineering or related field and 1+ year of Mechanical Engineering or related work experience.
OR
PhD in Mechanical Engineering or related field.

Job Overview

The successful candidate will operate as a member of Corporate Engineering department.  Responsibilities include working with US and India teams to conceptualize and design high performance electronic assemblies for Mobile, Modem, Compute, Auto, IOT etc.  Specific tasks include daily use of Creo solid modeling software, concept layouts, defining rigid and flexible circuit board outline and mounting constraints, electronic file transfers to/from circuit board CAD designers, shielding/gasket design, design of mechanical parts and system assemblies, creating detailed mechanical drawings, specifying dimensional tolerances and tolerance stackups, creating BOMs for assemblies, working with internal teams for optimal selection of batteries, displays, and audio components, working with internal machine shop for prototypes, and working with external suppliers for design collaboration and fabrication, including injection molded tooling.  Candidate will perform thermal analysis and simulations needed for the system design and enable heatsink designs and cooling requirements, work with Flotherm, Ansys ICEPAK, and other simulation tools as needed. The candidate will interface with internal staff and outside partners in the fast-paced execution of a variety of multi-disciplined projects. Leadership skills are expected on all projects to help direct, capture and interface with outside consultants.

Minimum Qualifications

• 2+ years actively involved in the mechanical engineering, Thermal Engineering and design of high-density electronics packaging.
• 2+ years’ experience in a mechanical / Thermal engineering role designing electronics products / systems.
• Solid modeling experience utilizing Creo, Simulation experience in Flotherm or ANSYS icepak.

Preferred Qualifications

• Expected to possess a strong understanding of mechanical engineering, thermal engineering and design fundamentals.
• Experience with defining outline, mounting, and I/O constraints of electronic circuit boards.
• Demonstrated ability for tolerance analysis and specification, including GD&T fundamentals.
• Demonstrated success in working with HW, component engineering, and other cross functional teams.
• Demonstrated success in working with HW and thermal analysis teams for appropriate thermal mitigation techniques.
• Solid understanding of design fundamentals for CNC, injection molded and stamped metal parts.
• Demonstrated ability working with supplier base for successful design collaboration and volume production.
• Strong experience with Creo solid model assembly, part, and drawing creation and Data storage.
• Experience with top-down skeleton model structuring and master model design techniques within Creo.
• Experience with IDF/EMN file exchange between mechanical and HW teams.
• Understands project goals and individual contribution toward those goals.
• Effectively communicates with project peers and engineering personnel via e-mail, web meetings, and instant messaging including status reports and illustrative presentation slides.
• Interact and collaborate with other internal mechanical engineers for optimal product development processes and schedule execution.
• Possess excellent verbal and written communication skills
• Leadership skills to help direct, prioritize, and clearly set project tasks per schedule. Communicate milestones and directions to outside team members.

Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

If you would like more information about this role, please contact Qualcomm Careers.

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