Before there were smartphones or smart cities, before autonomous cars or 360 virtual reality videos, there was our technology. Headquartered in San Diego, for over 30 years Qualcomm’s inventions have inspired others to make the impossible, possible. From 5G to artificial intelligence, IoT to automotive and extended reality applications, Qualcomm is inventing the technologies of an intelligently connected future, spearheading research efforts for the next global wireless standard, and collaborating with industry leaders in the wireless value chain to make this future a commercial reality. You’re bringing skills. We’ll provide the environment and the experience to push your limitless potential. Join us for our U.S. 2025 summer intern class! 

As a Qualcomm Mechanical Engineering Intern you have a passion in mechanical engineering or materials science and are looking to have the opportunity to work within areas of signal integrity, IC packaging, high performance chip/package CPI analysis, power integrity, thermal engineering and more!

Minimum Qualifications

• Currently enrolled in a bachelor’s, master’s, or Ph.D. degree program in computer engineering, computer science, electrical engineering, or a related field

• 1+ years’ academic experience with programming languages such as Python, Matlab

• Must be available for 11 – 14 weeks during Summer 2025 (May-September) with a graduation date of December 2025 or later

Preferred Qualifications

• Familiarity with Cadence Sip, AutoCAD and Solidworks.

• Coursework in Solid Mechanics, Mechanics of Materials and Finite Element Analysis (FEA)

• Knowledge in Mechanical design, heat transfer, microelectronics device.

• Knowledge of IC packaging structures, chip-package, electronic packaging process and package-board interaction.

• Server product design, system impedance testing, fan performance measurement and heatsink design methodology.  

• Thermal system design, analysis, modeling, testing and next generation cooling solutions

• Package design, advanced packaging and heterogeneous integration

• Thermal management of electronics

• Computational Fluid Dynamics  

• Wind tunnel and/or air flow bench operation  

• Candidates actively pursuing a degree with an anticipated graduation within the upcoming year preferred Dec 2025 to June 2026.

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Qualcomm’s Internship Program

Our interns join world-class teams to help define and build what is next for mobility and the world.  You’ll be paired with a mentor with visibility to your project and team, receive support from your manager, and have access to the entire Qualcomm employee community to ensure your success. To round out your summer internship, we host professional development workshops, social events, cross-functional speaker sessions, and an executive speaker series. In addition to competitive hourly pay and accrued vacation time, you will receive relocation coverage and furnished housing accommodations for the duration of your internship. 

By applying here, you are expressing interest in one of our many 2025 Qualcomm Mechanical Engineering internships. It is important to note that this is not a job posting for a specific role. We will review resumes on an ongoing basis, and a recruiter may reach out to you.