Job Description

Company:

Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:

CHS (Central Hardware Systems) Architecture and Design team at Qualcomm has an opening for Package/System Design Engineer. This team is responsible for road mapping, architecting, design methodology, design implementation and verification for all Qualcomm package products (Digital, IOT, RF, Analog, PMIC, etc...). Job responsibilities for this position include package selection, package design, and / or package EE modeling. This involves optimizing system co-design of IC-PKG-PCB die keeping in mind package footprint/height constraints, IC floor-planning, PCB, high-speed signal integrity , power distribution network, Mechanical and thermal constraints. 

Additional responsibilities: 

- IC top level floor-planning including hard macro block placement, padring, RDL and bump pattern/assignment 

- System level co-design methodology of IC, Package and PCB/Board 

- Concept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level cost 

- Package design flow methodology implementing high speed interface SI constraints for jitter, IR drop, cross-talk, and SSN specs 

- Package design flow methodology implementing power distribution network (PDN) constraints for high speed processor cores (1GHz+) including design optimization techniques at the die/pkg/PCB levels 

- Working with marketing/IC/product teams on competitive analysis and road mapping package technology for future products

Additional Requirements:

• Experience in IC package, SIP module and/or PCB selection, design and layout. 
• Experience in Pinmap optimization of optimal package, SIP module and/or PCB designs
• Experience in IC, package, PCB co-design for system performance optimization. 
• Hands on experience with Cadence SIP and/or Mentor Xpedition.
• Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements.
• Familiar with assembly and substrate manufacturing process is a plus
• Experience in IO + PKG + PCB SI/PI modeling, co-simulation and analysis
• Strong knowledge in 3D/2D EM simulation tool, electromagnetic theory and transmission line theory

Minimum Qualifications

Education:

• Master's degree or Bachelor's in Mechanical Engineering and/or Electrical Engineering

Preferred Work Experiences:

• Good to have 2+ years ASIC design, verification, or related work experience

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range and Other Compensation & Benefits:

$108,400.00 - $162,600.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm.  We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus).  In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.

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