Principal Engineer, Packaging in San Diego, CA at honor foundations

Date Posted: 4/1/2025

Job Snapshot

  • Employee Type:
    Full-Time
  • Location:
    San Diego, CA
  • Job Type:
  • Experience:
    Not Specified
  • Date Posted:
    4/1/2025

Job Description


Company:

Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:

Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work! 

The Qualcomm Package Electrical Team has an opening in the areas of signal integrity and power integrity. The candidate will work with package and IC designers to find ways to optimize the overall package design. The candidate’s responsibility is working with substrate designers to make sure all system level constraints are met prior to the package Tape-out. The candidate is expected to communicate with PHY owners to understand the Specs for various IPs such as PCIe, UFS, USB, MIPI, LPDDR, etc, and also with PCB designers to assess the impact of Ball assignment to the system level performance. This position offers the opportunity to work across multiple organizations such as PHY team, Package team, PCB team and PSIG and providing timely feedback and updating design guideline to the team is essential. This is a leadership position and candidate should be able to work independently and provide technical guidelines to upper management for key decision making process.

The responsibilities will include but not be limited to the following:

  • Perform package extraction for the time domain and frequency domain analysis
  • Perform system-level analysis for DDR, SerDes & Mixed signal interfaces
  • Provide design guidelines for the Package design
  • Being able to perform system simulation and provide feedback for design optimization
  • Develop design & analysis flow and automate the process
  • Create technical documentation and presentations

Minimum Qualifications:

  • 10 years of experience in DDR/SerDes in Package/PCB/System Design related to Compute/Server standards
  • Experience in Electromagnetics and solid background on transmission line theory & Crosstalk
  • Proficiency in field solvers such as HFSS, Q3D, Sentinel-PSI and Clarity
  • Experience in simulation tools such as ADS and Hspice
  • Working knowledge in Cadence Allegro/APD/Sip or Mentor Xpedition

Preferred Qualifications: 

  • Experience in SerDes design specifications such as PCIe Gen-x, USB, UFS in Server design
  • Experience in Matlab to be able to automate existing simulation flow
  • Experience in programming language(c/c++) or scripting language(Perl/Python) is a plus
  • Master Degree or Ph.D with 15+ years of experience
  • Prior Management experience  

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range and Other Compensation & Benefits:

$201,600.00 - $302,400.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm.  We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus).  In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.

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